BOM Sourcing & Procurement
Global component procurement from authorized distributors and verified suppliers. Full BOM coverage — active, passive, and electromechanical — with anti-counterfeit verification on every shipment.
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Global component procurement from authorized distributors and verified suppliers. Full BOM coverage — active, passive, and electromechanical — with anti-counterfeit verification on every shipment.
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Bare-board manufacturing from 2 to 32 layers. FR-4, high-Tg, Rogers, aluminum, and flex/rigid-flex substrates. Impedance control, blind/buried vias, heavy copper up to 12 oz.
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High-speed surface-mount lines supporting 0201 to large-package components. Solder paste inspection (3D SPI), automated placement at 35K+ CPH, and reflow profiling per J-STD-020.
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Wave soldering and selective soldering for connectors, transformers, relays, and high-power components. Manual precision soldering for complex or low-volume builds. IPC-A-610 Class 2 & 3 compliant.
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Single-pass assembly combining SMT and through-hole on the same board. Dual reflow-wave process optimized for designs using both surface-mount ICs and through-hole connectors or power devices.
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0.4 mm pitch BGA and µBGA placement with X-ray verification. Void detection per IPC-7095. Capable of large-body BGA packages up to 55×55 mm with precision reflow profiling for each array.
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Microscopic visual inspection, X-ray verification, and electrical testing on incoming components. Every reel and tray is checked against manufacturer specifications before release to the production floor.
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Automated optical inspection on every board post-reflow. 3D X-ray for BGA ball integrity, void analysis, and hidden-joint verification. Solder quality validated to IPC-A-610 criteria before any board advances.
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Custom functional test fixtures built to your test protocol. ICT, flying probe, burn-in, and system-level integration. Final assembly into enclosures with cabling, labeling, and firmware loading — ready to ship.
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