We are not a catalog distributor. We source, validate, and deliver the components that keep your networks running.
Telecom deployment cycles span 2–5 years — spot pricing on NXP, ADI, and TI telecom-grade ICs isn't budgetable. ADD locks quarterly fixed pricing on recurring RU/DU BOM lines. HK buffer stock, weekly pull, price certainty through your entire deployment phase.
5G RU and DU BOMs span RF power, baseband processors, timing, power management, and Ethernet PHYs across 8–12 brands. ADD consolidates NXP + ADI + TI + Infineon + Broadcom into one PO, one QC package, one DDP shipment — simplified vendor management for telecom programs.
Telecom infrastructure components have 10–15 year deployment lifecycles. ADD tracks EOL notices for NXP, ADI, TI, and Marvell telecom-grade ICs and alerts your procurement team 6–18 months ahead. We coordinate lifetime buys and identify next-gen replacements before the LTB window closes.
When NXP LDMOS or Infineon GaN RF devices are on allocation, we cross-reference functionally equivalent alternates across Ampleon, Wolfspeed, MACOM, Qorvo. Drop-in or minor re-tune — our FAEs provide RF performance comparison data (gain, efficiency, linearity) so your PA design team can approve the alternate without restarting qualification.
NXP Layerscape communication processors, ADI AD9371/ADRV9009 RF transceivers, TI LMK series clock ICs, and Infineon GaN power transistors — in-stock at HK/SG for 5G RU and DU builds. When telecom OEMs push lead times past 30 weeks, our buffer inventory bridges the gap.
Telecom-grade semiconductor supply chain spanning RU, DU, and CU component trees. NXP (RF LDMOS/GaN, Layerscape processors), ADI (high-speed data converters, RF transceivers), TI (clock distribution, power management), Infineon (GaN RF power, LDMOS), Marvell/Broadcom (Ethernet PHY, switch silicon). Sourced from authorized distribution and vetted independent channels — full lot traceability.
Data Center
Telecom & 5G
Automotive
Medical
Industrial Automation
Aerospace & Defense
Energy & Power
UAV & Robotics
Automotive-grade MCUs are on severe allocation. Tier-1 suppliers face production line stoppages waiting for 32-bit MCU deliveries.
Multi-source AEC-Q100 MCU alternatives, 2-week delivery
Sealed connectors and high-speed FAKRA/HSD interconnects face extended factory lead times, delaying harness production.
Global connector sourcing network, 10-day ship
Sourcing from unauthorized channels means missing Production Part Approval Process documentation - a non-starter for automotive quality systems.
Full PPAP Level 3 documentation with every order
When your only qualified MOSFET supplier goes on allocation, your entire power stage is at risk with no fallback.
Cross-reference AEC-Q101 alternates with matching footprints
AEC-Q100 qualified: STM32, SPC5, RH850 - 32-bit ARM Cortex-M/R for body, chassis, and gateway.
AEC-Q100 PMICs, DC-DC converters, gate drivers - power supply for ADAS, infotainment, and body.
AEC-Q101 MOSFETs, IGBTs, SiC, and diodes - from 40V body electronics to 1200V traction inverters.
Automotive-grade connectors, MLCCs, resistors - sealed, high-speed, and high-temperature rated.
An EV Tier-1 supplier building on-board chargers needed SiC MOSFETs, isolated gate drivers, current sensors, and AEC-Q200 MLCCs - fragmented across 12 different vendors with lead times from 4 to 26 weeks.
ADD consolidated the entire BOM, sourcing SiC discretes from multiple authorized channels and holding buffer stock at our Hong Kong warehouse. We delivered synchronized weekly batches against production schedules. 18% cost reduction through consolidated procurement. Zero line stoppages.
Contact us
