We are not a catalog distributor. We source, validate, and deliver the components that keep your autonomous systems flying.
UAV platform production runs span 2–5 years with quarterly build pulses. ADD locks quarterly fixed pricing on recurring flight controller BOM lines — STM32H7 MCUs, TI motor drivers, Infineon GaN FETs. HK buffer stock, weekly pull. Price certainty across your platform generation — no batch-to-batch cost surprises.
Drone and robot BOMs span flight controller MCUs, IMUs, ESCs/gate drivers, power management, RF modules, and lightweight connectors across 10–15 brands. ADD consolidates STMicroelectronics + TI + Infineon + TDK + Molex/JST into one PO, one QC package, one DDP shipment. One relationship for your entire airframe electronics stack.
UAV platforms iterate rapidly — component EOL mid-production-run is a program risk. ADD monitors STM32, TI, Infineon, and TDK UAV-grade product lifecycle notices and alerts you 6–12 months ahead. We coordinate lifetime buys and cross-reference next-gen replacements before your flight controller BOM is compromised.
When STM32H7 flight controller MCUs or TI motor drivers are on allocation, we cross-reference pin-compatible alternates across NXP i.MX RT, Microchip SAM, Renesas RA, onsemi. Our FAEs provide peripheral mapping, RTOS compatibility, and SWaP comparison so your embedded team can evaluate the alternate within 48 hours — same footprint, same toolchain, no PCB respin.
STM32H743/H753 flight controller MCUs, TI DRV series BLDC gate drivers, Infineon GaN power stages, and TDK IMUs are our highest-turn UAV and robotics lines. HK buffer stock across 1,200+ compact, lightweight component part numbers. When drone OEMs ramp for new platform launches, our buffer inventory bridges the factory allocation gap.
Compact, SWaP-optimized semiconductor supply chain for UAV and robotics applications. STMicroelectronics (STM32H7/F7/G4 flight controller MCUs, IMUs), TI (battery management, motor drivers, mmWave radar), Infineon (GaN power stages, BLDC gate drivers, XENSIV sensors), onsemi (image sensors, LiDAR APDs), TDK/InvenSense (IMUs, barometric pressure sensors). Multi-sourced — authorized where available, vetted independent for NPI and prototype flexibility.
Data Center
Telecom & 5G
Automotive
Medical
Industrial Automation
Aerospace & Defense
Energy & Power
UAV & Robotics
Automotive-grade MCUs are on severe allocation. Tier-1 suppliers face production line stoppages waiting for 32-bit MCU deliveries.
Multi-source AEC-Q100 MCU alternatives, 2-week delivery
Sealed connectors and high-speed FAKRA/HSD interconnects face extended factory lead times, delaying harness production.
Global connector sourcing network, 10-day ship
Sourcing from unauthorized channels means missing Production Part Approval Process documentation - a non-starter for automotive quality systems.
Full PPAP Level 3 documentation with every order
When your only qualified MOSFET supplier goes on allocation, your entire power stage is at risk with no fallback.
Cross-reference AEC-Q101 alternates with matching footprints
AEC-Q100 qualified: STM32, SPC5, RH850 - 32-bit ARM Cortex-M/R for body, chassis, and gateway.
AEC-Q100 PMICs, DC-DC converters, gate drivers - power supply for ADAS, infotainment, and body.
AEC-Q101 MOSFETs, IGBTs, SiC, and diodes - from 40V body electronics to 1200V traction inverters.
Automotive-grade connectors, MLCCs, resistors - sealed, high-speed, and high-temperature rated.
An EV Tier-1 supplier building on-board chargers needed SiC MOSFETs, isolated gate drivers, current sensors, and AEC-Q200 MLCCs - fragmented across 12 different vendors with lead times from 4 to 26 weeks.
ADD consolidated the entire BOM, sourcing SiC discretes from multiple authorized channels and holding buffer stock at our Hong Kong warehouse. We delivered synchronized weekly batches against production schedules. 18% cost reduction through consolidated procurement. Zero line stoppages.
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