// Who We Are
Authentic Components, Transparent Sourcing
ADD Components Co., Limited was founded in Hong Kong to bridge a critical gap in the electronics supply chain. Industrial OEMs in Eastern Europe and Central Asia need fast, reliable access to high-end semiconductors and optical modules - without the risk of counterfeits or the delays of fragmented sourcing.
We specialize in FPGAs, MCUs, analog ICs, memory, connectors, and optical transceivers from 1G to 400G. Our Hong Kong headquarters and Shenzhen logistics hub enable 5-day delivery with consolidated multi-carrier shipping and full customs documentation.
Beyond distribution, our PCBA partner network lets customers combine component procurement and board assembly under a single purchase order - one supplier, one invoice, one point of accountability.
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// Experience. Execution. Excellence.
What We Do
Global Component Sourcing. 20,000+ SKUs across 12 major brands - Xilinx, Altera, ST, TI, ADI, Microchip, Infineon, NXP, TE, Molex, Vishay, and Finisar. Authorized and verified channels. Hard-to-find and EOL parts sourced globally.
Anti-Counterfeit Verification. Every IC undergoes incoming visual inspection, date-code verification, and X-ray for BGA/QFN packages. Full batch traceability from supplier to your dock. No counterfeits - guaranteed.
Logistics & Delivery. 5-day delivery from Hong Kong HQ and Shenzhen logistics hub. Consolidated multi-carrier shipping with full track-and-trace. Customs-compliant export documentation included. We handle the paperwork so you don't have to.
Engineer-Level Support. We review your BOM for lifecycle risk, suggest pin-compatible alternatives, and help optimize cost - before you place the order. Real engineering insight, not a sales script.
Learn MoreOur Purpose,Our
Mission,And Our Vision & trategy
Our Philosophy
Our Vision
Our Strategy
How We Verify Every Component
Four-stage inspection process. Zero counterfeits. Every shipment.
1. Incoming Inspection
Package integrity check. Packing list vs. physical count verification. Barcode scanning for batch entry into our traceability system.
2. Visual Check
Marking consistency, pin straightness, body condition under microscope. Every IC, every reel inspected against manufacturer datasheet specifications.
3. X-Ray Verification
Internal lead-frame and wire-bond inspection for BGA, QFN, and high-value packages. Counterfeit anomalies detected at die level - invisible to the naked eye.
4. ESD Pack & Ship
ESD-safe packaging, humidity-controlled sealing, batch-labeled for full forward and backward traceability. Track-and-trace activated on every shipment.