We are not a catalog distributor. We source, validate, and deliver the components that keep your racks running.
Volatile DDR5 and FPGA spot pricing wreck budget cycles. ADD locks quarterly fixed pricing on your recurring BOM lines — Xilinx FPGAs, Samsung DDR5, TI PMICs. Pull weekly from HK buffer stock. Price certainty through your deployment cycle. No MOQ penalties, no market-surprise surcharges.
Hyperscale BOMs span 10–15 brands across FPGAs, memory, power, timing, and connectors. ADD consolidates Xilinx + Micron + TI + ADI + Samtec + TE into one PO, one QC package, one DDP shipment. You manage one supplier relationship instead of six procurement workflows.
Authorized and vetted independent channels for data center semiconductor brands: Xilinx (Kintex, Virtex, Zynq), Intel/Altera (Agilex, Stratix), TI (power management, hot-swap), ADI (high-speed converters, clocking), Samsung/SK hynix/Micron (DDR5, HBM). Every line item source-disclosed — authorized where available, vetted independent where authorized allocation is exhausted.
FPGA families move to NRND/obsolete status every 18–24 months. ADD monitors your BOM against Xilinx, Intel, and TI EOL notices and alerts you 6–12 months ahead of the last-time-buy window. We coordinate LTB quantities and cross-reference next-gen alternatives before the deadline — not after your line is already down.
When TI power stages or ADI converters go on 20+ week allocation, we cross-reference functionally equivalent alternates across Infineon, onsemi, STMicroelectronics, Renesas. Pin-compatible or drop-in — our FAEs provide parametric comparison tables so your engineering team approves the alternate in hours, not weeks. No redesign, no requalification delay.
DDR5 RDIMM/LRDIMM, Xilinx Kintex/Virtex FPGAs, TI PMBus controllers, and ADI precision timing ICs are our highest-turn data center lines. HK/SG buffer stock across 2,000+ part numbers. When hyperscaler build cycles drain authorized channels, our parallel inventory keeps your BOM moving without waiting on factory allocation.
Data Center
Telecom & 5G
Automotive
Medical
Industrial Automation
Aerospace & Defense
Energy & Power
UAV & Robotics
Automotive-grade MCUs are on severe allocation. Tier-1 suppliers face production line stoppages waiting for 32-bit MCU deliveries.
Multi-source AEC-Q100 MCU alternatives, 2-week delivery
Sealed connectors and high-speed FAKRA/HSD interconnects face extended factory lead times, delaying harness production.
Global connector sourcing network, 10-day ship
Sourcing from unauthorized channels means missing Production Part Approval Process documentation - a non-starter for automotive quality systems.
Full PPAP Level 3 documentation with every order
When your only qualified MOSFET supplier goes on allocation, your entire power stage is at risk with no fallback.
Cross-reference AEC-Q101 alternates with matching footprints
AEC-Q100 qualified: STM32, SPC5, RH850 - 32-bit ARM Cortex-M/R for body, chassis, and gateway.
AEC-Q100 PMICs, DC-DC converters, gate drivers - power supply for ADAS, infotainment, and body.
AEC-Q101 MOSFETs, IGBTs, SiC, and diodes - from 40V body electronics to 1200V traction inverters.
Automotive-grade connectors, MLCCs, resistors - sealed, high-speed, and high-temperature rated.
An EV Tier-1 supplier building on-board chargers needed SiC MOSFETs, isolated gate drivers, current sensors, and AEC-Q200 MLCCs - fragmented across 12 different vendors with lead times from 4 to 26 weeks.
ADD consolidated the entire BOM, sourcing SiC discretes from multiple authorized channels and holding buffer stock at our Hong Kong warehouse. We delivered synchronized weekly batches against production schedules. 18% cost reduction through consolidated procurement. Zero line stoppages.
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