BGA & Fine-Pitch Placement
0.4 mm pitch BGA and µBGA placement with X-ray verification. Void detection per IPC-7095. Capable of large-body BGA packages up to 55×55 mm with precision reflow profiling for each array.
0.4 mm pitch BGA and µBGA placement with X-ray verification. Void detection per IPC-7095. Capable of large-body BGA packages up to 55×55 mm with precision reflow profiling for each array.