SMT Assembly
High-speed surface-mount lines supporting 0201 to large-package components. Solder paste inspection (3D SPI), automated placement at 35K+ CPH, and reflow profiling per J-STD-020.
High-speed surface-mount lines supporting 0201 to large-package components. Solder paste inspection (3D SPI), automated placement at 35K+ CPH, and reflow profiling per J-STD-020.