AOI & X-Ray Inspection
Automated optical inspection on every board post-reflow. 3D X-ray for BGA ball integrity, void analysis, and hidden-joint verification. Solder quality validated to IPC-A-610 criteria before any board advances.
Automated optical inspection on every board post-reflow. 3D X-ray for BGA ball integrity, void analysis, and hidden-joint verification. Solder quality validated to IPC-A-610 criteria before any board advances.