NSR01L30NXT5G
These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current. The DSN2 (Dual Silicon
No−lead) package is a chip level package using solder-able metal contacts under the package similar to DFN style packages. The DSN style package enables 100% utilization of the package area for active silicon, offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
Features
• Very Low Forward Voltage Drop − 400 mV @ 10 mA
• Low Reverse Current − 0.2 A @ 10 V VR
• 100 mA of Continuous Forward Current
• ESD Rating − Human Body Model: Class 3B
                   − Machine Model: Class C
• Power Dissipation of 312 mW with Minimum Trace
• Very High Switching Speed
• Low Capacitance − CT = 7 pF
• This is a Halide−Free Device
• This is a Pb−Free Device